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Ball Grid Arrays (BGA)

A family of BGA heat sinks offers a wide range of cooling solutions for motherboard, video card, and networking applications.

Bonded Fin Heat Sinks

Bonded Fin technologies cool high power applications with high fin densities unavailable in extrusions.

Extrusions

Pinpoint the right extrusion from the many profiles available

Folded Fin Heat Sinks

Folded Fin assemblies offer maximum forced air cooling in a minimum volume.