Specifications50-02-1038-0000 Reference : 15150-02-1038-0000Brand :Chomerics (Parker)CHO-BOND 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics CHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding.More ▼Get Shipping EstimateZIP*Non-stock pricing and lead time may be subject to change based on manufacturing availability.
SpecificationsCB359-50 Reference : 152CB359-50Brand :Click BondEPOXY ADHESIVEGet Shipping EstimateZIP*Non-stock pricing and lead time may be subject to change based on manufacturing availability.
