TP-107-02-1-S

How the fabricators of SMT printed wiring boards may take advantage of the convenience of field testing with the unique loop design of Components Corporation's TP-107 series of surface mounted, printed circuit test points. The profile of the TP-107 readily accepts most commercially available spring clips and probes while providing a positive and secure anchor to the SMT board. Since a test point is subject to mechanical stress, the strenght of its bonding, particularly on a surface mount design, is crucial. The TP-107 schieves this through a unique forming process which doubles the surface area of the test points mounting. This is accomplished by forming the flat wire design in a spiral wrap on the mounting base resulting in an adhesion to the solder pad which requires in excess of 18 pounds of force to disloge the test point from its solder pad. TP-107 surface mount test points are available in two formats: bulk packaged and tape-and-reel configuration. The taped version is fully compatible with ANSI/EIA-481 standards. To insure a smooth flow to the solder pad, the TP-107 test point is palted with .0001 minimum matte tin finish over .0001 nickel underplate. For increased reliability and safety, the TP-107 is now available in silver-plated and matte tin finish. The product is manufactured using Components Corporation's proprietary technology, assuring the highest possible performance. The TP-107 is formed from phosphor bronze flat alloy wire which is spring tempered or from copper alloy wire. Recommended mounting pad dimensions are 0.185' x 0.135'.