Specifications50-02-1038-0000 Reference : 15150-02-1038-0000Brand :Chomerics (Parker)CHO-BOND 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics CHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding.More ▼Get Shipping EstimateZIP*Non-stock pricing and lead time may be subject to change based on manufacturing availability.
Specifications50-02-0584-0029 Reference : 15150-02-0584-0029Brand :Chomerics (Parker)RF EMI EMI Conductive Adhesive CHO-BOND® 584-29 EpoxyGet Shipping EstimateZIP*Non-stock pricing and lead time may be subject to change based on manufacturing availability.
