Chomerics (Parker)
50-02-1038-0000
Reference # : 15150-02-1038-0000
Product description
CHO-BOND 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics CHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding.
Product certifications may be available for this product. Please email customerservice@biscoind.com to inquire about available certifications.
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